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Case Study Microscopically Small Markings on Silicon Wafers

In today's world where component traceability is critical, SiMPore, a leading supplier of silicon nanomembrane and BioMEMS technologies, faced a unique challenge: marking tiny product IDs on delicate silicon wafers without damaging them. This case study demonstrates how SiMPore took an outsourced process back in-house by implementing a customized FOBA ultrashort pulse laser marking system, resulting in increased quality and productivity.

Photonic sensor substrate* with marked human readable text about 140µm in height, and DMC code 285µm by 285µm.

Contents

SiMPore’s silicon wafers are thin and fragile substrates essential for the production of microelectronic devices, requiring precise laser marking for traceability. Previously outsourced, SiMPore aimed to establish an in-house marking process to mark the approximately 500 µm thick wafers safely and ensure permanent traceability without damaging the delicate wafers.

The greatest challenge for SiMPore lies in ensuring high-precision markings with minimal heat impact to avoid damage to the closely packed microchips. Achieving this level of precision is critical to maintaining the integrity and functionality of the wafers.

Overview

In the case study, you will gain insights into:

  • SiMPore's challenges in laser marking silicon wafers.
  • Why laser marking with the F.0100-ir ultrashort pulse laser marker is so protective for the sensitive silicon wafers.
  • How the M3000-P combined with the HELP process improves automation workflows and HELP process for more efficiency an efficient and reliability throughout the entire reliable workflow.

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